Lead free solder can cause many problems during PCBA test. Lead free solder has a higher reflow temperature.
which can result in harder and stickier solder flux resin and a thicker, harder oxide layer. This thicker layer of resin and oxide is more difficult to penetrate and increases wear on the pogo pin. Lead free solder resin and oxides can also increase debris transfer to spring probes. These are many of the issues found in OSP and No-Clean applications. ECT’s LFRE series of test probes were specifically designed to solve these challenges.
which can result in harder and stickier solder flux resin and a thicker, harder oxide layer. This thicker layer of resin and oxide is more difficult to penetrate and increases wear on the pogo pin. Lead free solder resin and oxides can also increase debris transfer to spring probes. These are many of the issues found in OSP and No-Clean applications. ECT’s LFRE series of test probes were specifically designed to solve these challenges.
ECT Lead Free POGO® Series
ECT’s LFRE probe line incorporates a number of features that will significantly reduce the issues that arise when switching to lead free solder as well as those contact issues that arise with OSP and No-Clean solder flux.
• LFRE Plating – Our Lead Free probe incorporates a harder and slicker plating that not only resists wear but also reduces solder and debris
ECT’s LFRE probe line incorporates a number of features that will significantly reduce the issues that arise when switching to lead free solder as well as those contact issues that arise with OSP and No-Clean solder flux.
• LFRE Plating – Our Lead Free probe incorporates a harder and slicker plating that not only resists wear but also reduces solder and debris
transfer.
• Higher Preload – All of our LFRE probes incorporate higher preloads. Higher preload reduces spring force variation with board flex and
• Higher Preload – All of our LFRE probes incorporate higher preloads. Higher preload reduces spring force variation with board flex and
increases the initial impact penetration, resulting in higher first pass yields.
• PogoPlus® Bias Ball Design – The PogoPlus internal bias ball design guarantees uninterrupted electrical contact with the probe sidewall
• PogoPlus® Bias Ball Design – The PogoPlus internal bias ball design guarantees uninterrupted electrical contact with the probe sidewall
virtually eliminating probe-related false opens.
• Pointing Accuracy – ECT’s LFRE and POGO probes incorporate a double roll close, which offers the industry’s best pointing accuracy.
Increased pointing accuracy means the probe is less likely to touch the edge of the pad where the solder flux accumulates, a great benefit
when using Lead Free solder and/or No-Clean.
LFRE Plating vs. the Industry Standard Plating. The industry standard for plated POGO pins is gold electroplate alloyed either with cobalt or nickel to enhance its hardness. Hardness is increased from 90 Knoop for 99.7 % pure electroplated gold to 130 to 200 Knoop when alloyed with nickel or cobalt. ECT’s LFRE plating is significantly harder than the industry’s standard gold plating. Our new proprietary plating has a hardness range of 550 to 650 Knoop. This makes the probe tips more durable and less susceptible to solder and material transfer.
